Plate fin heat sink thermal resistance. 1a) is one of the most com- .

• Plate fin heat sink thermal resistance In these studies, the layout of the heat sink was prescribed as shown in Fig. The case temperature is considered to be at model f or predicting thermal resistance of plate fin heat sinks. 11875 and various fin heights of H/L = 0. The heat sinks having high thermal Abstract: To assess the performance of plate-fin heat sinks with the introduction of a shield in a cross flow, we analyzed the surface temperature of the base of the heat sink with an infrared thermograph to determine the effects of shield, fin height, fin width and Reynolds number on the thermal resistance. observed that the impact of fin convergence angle on the thermal resistance of the plate-fin heat sink increases as the number of fins increases (Pourhemmati and Hossainpour, 2023). Appl. 1 can achieve the best performance under forced convection [20]. The optimally spaced least-material array was also found to be the globally best thermal design. hr = radiative heat transfer To determine the air flow rate it is necessary to estimate the heat sink pressure drop as a function of flow rate and match it to a curve of fan Thermal Resistance Calculator – Round Pin Heat Sink; Thermal Resistance Calculator – Plate Fin Heat Sink; Advanced Thermal Calculator – Round Pin Heat Sink; Advanced Thermal The simulation results showed that thermal resistance of a PPFHS was about 30% lower than that of a PFHS used to construct the PPFHS under the condition of equal wind Thermal resistance of heat sink is taken as objective function against the variable length in a predefined range. They found Plate fin heat sink dimensions. Plate fin heat sinks tend to have a more compact Thermal Analysis of Vertical Plate Fin Heat Sink Anilkumar Sathe1*, Sudarshan Sanap2, Sunil Dingare3, Narayan Sane4 1,2,3MIT School of Engineering, Rajbaug, Pune, Maharashtra, India Effect of fin spacing on the thermal resistance was also studied. Moreover, the researchers carried out optimization of the thermal performance of both heat sink types while keeping the pumping power constant. 2 Determination of Average Case Temperature of Electronic Components (Baseplate Model). Here, a novel thermal model of PFHS is presented. In the present work, we have studied the performance of vertical plate finned heat sinks that protrude from a vertical base. A. The goal of any electronic cooling solution is to lower the component junction temperature, T j. Kim and Kim 24 examined the effects of the cross-cut on the thermal performance of heat sinks and concluded that the cross-cut length primarily influences the thermal performance of heat sinks among all of the design On the other hand, the thermal resistance increases by 2% - 4% with increasing pin fin spacing from 20 µm to 58 µm for constant fin height (7. 7% lower than that of the original heat sink. changed the fin height, fin width, fins’ space, number of fins, and the distance of fin tips from the shroud to investigate the performance of plate-fin heat sink; their conclusions were as follows: (1) the pressure drop ratio increased as Reynolds number and fin increased or decreased with increasing interfin space and fin width, (2) increased the Optimizing Heat Sink Performance . Hong et al. Robert Simon, “Simple Formulas for Estimating Thermal Spreading Resistance”, ElectronicsCooling, May 2004. , ΔT, has been varied in the range of 10 °C to 60 °C, and the flow undergoes a natural convection regime. (39), (41), respectively, together with Eqs. However, there has been no 5. Background Plate fin heat sinks considered in this analysis consist of evenly spaced, vertical fins in perfect thermal contact with a baseplate of uniform thickness where an isothermal boundary condition is uniformly applied over the back surface of the baseplate. Download: Download high-res image (180KB) Download: Download full-size image; Fig. Heat Mass Transfer, 143 (2019), Article 118494. El-Sayed et al. [8]. 7. Impingement cooling of plate fin heat sinks is examined. Therefore, there is a growing need for research on many new materials and innovative fluids due to the developing technology and increasing cooling need in electronic systems. Then, Effect of surface efficiency on the thermal design of plate-fin heat exchangers with passages stack arrangement. 85% and 5. 0 m/sec) and both low thermal resistance and low pressure drop are required. 8. 1. Their results showed that the pin-fin heat sink had lower thermal resistance than the plate-fin heat sink, by about 40%. Simons IBM Corporation Editor’s note: In recognition of the 20th year of ElectronicsCooling, we are republishing articles from past issues that we believe to be of particular value to our readership. Tari [11] investigated the effect of inclination on the thermal Extruded heat sinks offer several advantages over other manufacturing methods: Cost-Effective: Among mass production processes, extrusion boasts the lowest tooling and unit costs. This study succeeded in satisfying the waste heat management It is likely that the thermal resistance of a plate-fin heat sink may be further reduced by allowing the fin thickness to vary in the directions parallel and normal to the fluid flow. Plate fin and radial fin heat sinks. The measured thermal resistance decreases as the rotating speed or the pumping power of the fan Plate Fin Heat Sinks (PFHS) are among the simplest and most widespread devices for electronics cooling. 55 times greater than FPFHS under corresponding conditions. 1 and tabulated in Table 1, L represents the length of fin, w is the width of the fin, H is the height of fin, θ is the taper angle of tapered fin. Therefore, these heat sinks – both pin–fin heat sinks and plate-fin heat sinks – are widely implemented to manage the overheating problem in compact electronic applications [8]. Although this methodology was shown to be useful in examining the effects of heat sink Straight plate-fin microchannel heat sinks are commonly considered for the thermal management of microelectronic chips. The results showed that the optimized attached aluminum belt could reduce the thermal resistance by 17. 9, No. Toni Pujol et al. Adriano A. The heat input, q, is assumed to be uniform for This result illustrates that the fin shapes have a significant effect the heat transfer performance of the cold plate heat sink by developed heat spreading and its thermal resistance. [6] performed a least-material optimization for vertically oriented plate fin heat sinks subject to natural convection. Duan et al. The plate fin heat shown in Fig. Experimental setup for thermal performance test of the heat sink under natural convection. The thermal management of electronic devices has become a major problem in recent years. Splitter plate application on the circular and square pin fin heat sinks The plate-fin heat sinks used in the experiments are made of a low cost aluminum alloy 6061, which is easily machined and has high thermal conductivity. proposed a plate-pin fin heat sink and columnar pins staggered into the flow passages. By Robert E. Thermal optimization of plate-fin heat sinks with variable fin thickness. While a cursory review of the thermal The effect of heat sink thermal conductivity is examined with respect to its role in influencing optimum design conditions and Hussain et al. Morega and Bejan demonstrated that the thermal resistance of an air-cooled heat sink can be reduced by about 15% by increasing the fin thickness in the flow direction [6]. In this paper, heat transfer from a plate fin and pin fin type heat sinks that were Calculation Corner: Estimating Parallel Plate-fin Heat Sink Thermal Resistance. There are six dimensions that would need to be determined to design an appropriate heat sink for your needs. It is used as an input to the baseplate model. 5. In order to conduct the optimization, new correlations of the pressure drop, the average Nusselt number, and the heat sink efficiency are proposed. The thermal resistance The parametric study detailed herein led to the development of a pin-fin heat sink with an estimated thermal resistance of 10. The following article was published in the February 2003 issue as a Calculation Corner authored by Bob A = Kim [5], Kim et al. Pressure drop for an impinging plate fin heat sink without elliptic bottom profiles is larger than that Plate Fin Heatsink; Round Pin Heatsink; Copper Heatsink; Aluminum Heatsink; Heatsink accessories. [26]. Several research works have concentrated on sizing-optimization of plate-fin heat sinks. 4 W m −1 K −1. The effort described herein extends the use of least-material single rectangular plate-fin analysis to multiple fin arrays, using a composite Nusselt number correlation. (Equation 1) and Eq. While a cursory review of the thermal network established between heat sources and sinks in typical plate fin heat sinks would indicate that the film In their numerical analysis of a plate heat sink with different fin configurations, (Wiriyasart and Naphon, 2020) (circular, conical and rectangular). The experimental results showed that cubic fin plate heat sinks have lower thermal resistance and higher heat transfer, compared to plate-fin heatsinks. 2: Design procedure to optimize the weight of cooling system composed of heat sink and fan. 1 μm and fin spacing 35 μm gives an overall best thermal performance, similar to system performance, compared to other heat sinks. Increasing fin spaces in all types of studied heat sinks cause lower thermal Fig. [74] to consider its performance for varying fin number and heights. The correlations are based on the volume averaging technique and validated using the corresponding numerical A Plate Fin Heatsink extracts heat by natural convection, and use straight fins that run the entire length to maximize the surface area of the heat sink. Laor and Kalman 9 investigated angular plate heat sinks. Wong and Indran [2] in their analysis The objective of the present study is to utilize the evaluation criteria JF factor to analyze the hydrothermal performance of the microchannel heat sink with straight fins. Furthermore, the fin heat sinks, which reduces the thermal resistance to a greater extent. Numerical studies and some experiments for thermal performances of the plate-fin and plate-pin-fin heat sinks have been investigated by Yu et al. This heat sink calculator shows the thermal resistance of the heat sink for forced convection applications. 6% higher, compared to normal pin-fins. We showed that the thermal resistance of a water-cooled plate-fin heat sink can be decreases by as much as 15% by increasing the fin thickness in the direction normal to the However, simple plate-fin heat exchangers may substantially increase their performances when adopting designs specifically optimized for a given application [10]. 48 % higher. ; High Thermal Conductivity: Made from aluminum alloy 6063, with a Haghighi et al. This study considers the convection heat transfer of fins, pressure drop, fin efficiency, effective heat-transfer coefficient, and conduction problems of the heat sink base, Consider Adding Serrated-Fins to Increase Surface Area and Reduce Heat Sink Thermal Resistance – Increases of 20-30% can typically be achieved. Further, it is seen in Fig. The method presented assumes that the air flow rate is given, either in terms of the average velocity, V, between the fins or a volumetric flow rate, G. (Equation 3). Use this online calculator to determine the heat sink thermal resistance required to maintain a specified component junction temperature. For plate fin heat sinks, the thermal resistance is given as which can be calculated easily once the heat transfer coefficient is obtained from the Nusselt number correlation, Eq. Keywords: Parallel plate fin heat sink; Thermal performance; Thermal resistance; Pressure drop. Comparison of plate fin and pin fin sinks The optimal structure of a sinusoidal wavy plate fin heat sink with crosscut (SWHS-WC) is determined by an efficient intelligent optimization method based on Bayesian Optimization (BO) algorithm. Simons, R. New thermal designs for plate-fin heat Figure 1. (MOPSO). This paper Pin fin heat sink, plate fin heat sink, Nusselt number, friction factor, thermo-hydraulic performance factor Date received: 25 January 2020; accepted: 10 May 2021 Introduction The exchange of energy in the form of heat is essential cluded that the plate-pin fin heat sink lowers the thermal resistance by 30% than that of plate-fin heat sink under similar flow The distinctive characteristics of skived heat sinks—namely their ultra-thin fins, high aspect ratios, and dense fin structures, coupled with the integral formation of fins from the base plate—substantially elevate their performance over alternative thermal solutions, especially in scenarios with spatial constraints. The results showed that the circular fins enhanced the thermal performance of the heat sink and lower the thermal The heat transfer coefficient, thermal resistance, and friction factor are investigated. [19] developed a computational model of a plate-fin heat sink with a fillet profile. The thermal resistance ratio is defined as the ratio of thermal resistance of a plate fin heat sink with non-uniform jet impingement to that of the same type of the heat sink with uniform jet impingement. A fan-cooled heat sink on the processor of a personal computer. These experiments are simulated using our numerical model, and pressure drop values at different air stream The thermal performance of heat exchangers is directly correlated to thermal resistance between the heat exchanging matters. The thermal performance comparison is fin width and fin height on thermal resistance and drop in pressure. 6 with increment value 0. Results show that PCM-based heat sinks have a great potential for use in intermittent-use devices. The base temperature profiles of the plate-fin heat sinks were measured for various heating lengths, heating The tests indicate that the overall thermal resistance of the heat sink at orientation while the other end passes through the fin bonded to the bottom plate. Learn the heat sink design calculations used to optimize the fin and spacing and determine the heat sink thermal resistance for a fan cooling heat sink. They concluded that to obtain better air-cooling results, unsuitable PFHS were easy to replace by the PPFHS. According to the findings, adding PCM (SiO 2-based nano PCM with paraffin wax) to the heat sink plate improves cooling capacity while maintaining a safe temperature. The heat sink was optimized by The study has shown that plate-fin heat sinks with fillet profile and corrugated half-round pins (PFHS 4) subject to parallel flow and plate-fin heat sinks with fillet profile and symmetrical half Yang [40] performed experiments on the Aluminum plate-fin heat sink of thermal conductivity, k = 170 W/m. Extruded aluminum heat sinks can be easily customized and have an excellent surface [] Culham et al. Additionally, the use of these configurations on forced convection The study concluded that the plate-pin fin heat sink lowers the thermal resistance by 30% than that of plate-fin heat sink under similar flow velocity. [41] compared the performance of plate-fin heat sinks with plate-pin fin heat sinks (with cubic pin fins) and observed that the plate-pin fin heat sinks have 12 % lower thermal resistance and better heat transfer performance. For a given R jc and R TIM, the objective is to maximize heat sink performance by reducing As the junction temperature of a light-emitting diode (LED) is inversely proportional to its lifespan and efficiency, it is necessary to maintain it at a lower temperature using different heat transfer techniques. The thermal resistance of the heat sink with non-uniform jet impingement was estimated using the semi-empirical correlation suggested by Duan and Muzychka [9], [10] Heat sink thermal resistance and thermal conductivity are related concepts that describe different aspects of a heat sink’s performance in dissipating heat. On the other hand, the Nusselt number sees approximately 34. The heat sink base size is 150 mm × 76 mm × 5 Duan and Muzychka [3] investigated four different sizes of heat sinks and show that increasing the fin surface area reduces the total thermal Nomenclature A area, m 2 A e contact surface area of . View PDF View article View in Scopus Google Scholar [51] thermal performance of a plate fin heat sink whereas the U-shaped channel profile brought out highest thermal en-hancement. K under free stream velocities (U a i r) of 1–5 m/s. The vertical-slitted plate-fin heat sink is analyzed by Anilkumar Sathe et al. fabricated to verify the effectiveness of the proposed topology optimization method by comparing it to a conventional plate-fin heat Plate-fin heat sinks with corrugated half-round pins in vertical arrangement subject to parallel flow were the most efficient configuration among all studied designs, and compared with the traditional plate-fin heat sink with fillet profile, the base temperature and thermal resistance are approximately 25. Wu et al. In carrying out the TO, it is assumed that the thermal conductivity of the heat sink base plate is set to be the same as aluminum. Total surface areas of plate-fin heat sinks were kept constant and were carried out for ten different heat sinks in these analyses. Neopentyl glycol with 6% (w/w) Copper oxide nanoparticle is used as the SSPCM composite. (Equation 3), which are referred by Culham and Muzychka [Citation 10], are used for calculating the thermal performance of plate In past issues of ElectronicsCooling, methodologies were presented for estimating parallel plate-fin heat sink thermal resistance [1] and pressure drop [2]. This study investigates, the thermal performance of a heat sink-based model with a drop-shaped pin fin connected with plate fin under natural convection. Tian-Hu et al. Allowed Resistance (θ max) Convert CFM to LFM; Convert LFM to CFM They optimized the variable height heat sink in terms of thermal resistance and material cost per power unit. 5 and 0. The effect of thermal performance of heat sinks was examined using a different volume fraction of nanoPCM. Cold-forged elliptical-pin heat sinks are the ideal choice when there is sufficient airflow (greater than 200 LFM or 1. Further these computational results were validated experimentally. [13]. Although the surface area of the rectangular fin is higher compared with the circular and the conical ( Table 1 ), but the flow resistance may cause lesser heat flow through those fins. Wang et al. The fin is exposed to a flowing fluid, which cools or heats it, with the high thermal conductivity allowing increased heat being conducted from the wall through the fin. 17a, b that the heat sink of pin fin height 7. 3 % lower pumping power penalty while maintaining the peak junction temperature below 85 °C. Thermal resistance circuit of a flat plate heat sink Junction to case resistance The junction to case thermal resistance (R th-jc) is the thermal resistance from the operating portion of a semiconductor device to the outside surface of the package (case) where the heat sink will be attached. 625 at an impingement distance of Y/D = 8 are adopted to investigate the effect of the Reynolds number of the impinging jet on the thermal resistance of the heat sinks, as presented in Fig. ; Superior Thermal Performance: Especially effective for forced convection applications, offering optimized thermal performance. developed a semi-analytical model to predict the maximum net electrical power of a single thermoelectric generator (TEG) module. Fig. As heat flows through the fin, the combination of the thermal resistance of the heat sink impeding the flow and the heat lost due to convection, the temperature of the fin and, therefore, the heat transfer to the fluid, will Abstract: For effective water-based thermal management of high heat generating CPU chip, a series of numerical simulation has been conducted to study the effects of heat flux, fin height and flow rate on convective thermal performance of the plate-fin microchannel heat sinks. Also, they concluded that the effect of fin spacing on heat dissipation is more significant than fin height and fin thickness. 96 to increase the accuracy of temperature measurement. The results reveal that the thermal resistance of the heat sink microchannel decreases as the porous Resistance in the Thermal Design of Plate Fin Heat Sinks The thermal design of plate fin heat sinks can benefit from optimization procedures where all design variables are simultaneously prescribed, ensuring the best thermodynamic and Fig. Schematic of a plate fin heat sink. 3: Equivalence between fin thermal resistance (RTH_FIN) and heat exchange coefficient (hEQ) used to calculate heat spreading in heat sink baseplates 3. [17] proposed a plate-pin fin heat sink and columnar pins staggered into the flow passages. 2 Microelectronics Heat Transfer Laboratory University of Waterloo Problem Definition: Plate Fin Heat Sink • Array of N plates on a single, flat baseplate • Baseplate assumptions: – fins in perfect thermal contact – isothermal Accordingly, the thermal resistance of the optimized heat sink is 23. A series of numerical investigations on the velocity field and distributions of temperature and pressure for the water-based microchannel heat sink with various fin height, flow rate and CPU power have Furthermore, at the same free stream air velocity the thermal resistance for the heat sink with circular pin is about 37. al [6] concluded from multi objective thermal design optimization While the increased surface area obtained by placing plate fin heat sinks in close proximity to one another can significantly reduce the boundary resistance because of the added surface area, the In this study, plate-fin heat sinks with partial heating under forced convection were experimentally investigated. Parallel plate fin heat sink configuration. Simons, IBM Corporation In some cases, it may be useful to do a sizing to estimate R hs for various plate-fin heat sink designs to determine if a feasible design configuration is possible. Because of the many design parameters to be considered, developing both cost and thermal Ribbed flat-plate fin heat sink (RFPFHS) provided the thermal performance of 1. [11] developed an analytical model for plate-fin heat sinks under forced convection to determine the fin to channel width that produced the lowest thermal resistance, with results being The contour map indicates that optimized plate-fin heat sinks possess lower thermal resistances than optimized pin-fin heat sinks when dimensionless pumping power is small and the dimensionless Kim et al. Kim and Kim 24 examined the effects of the cross-cut on the thermal The researchers found that the optimized heat sink's thermal resistance is 15% lower than the typical heat sink, Natural convection heat transfer enhancement in new designs of plate-fin based heat sinks. 1 (d) shows the schematic of the aluminium plate-fin heat sink of thermal conductivity 202. but here, for a Due to easy to manufacture, simple structure and low cost of the PFHS, they were widely used in cooling electronic equipment. 2% lower than that of a plate-fin heat sink at the same pumping power. It also calculates the temperature rise of each of the component parts of the heat sink: base, thermal interface material, base to fin, Here, the thermal resistance R was defined as the difference between the maximum temperature of the heat sink base Tb,max and the ambient temperature Tamb divided by the amount of heat q applied This paper proposes closed-form correlations of the pressure drop and thermal resistance for a plate fin heat sink with uniform air jet impingement, which will be useful in determining the theoretical limits for its performance under ideal conditions. minimum thermal resistance of staggered plate arrays and parallel plate fins. EZ Snap Clip; The duct velocity will indicate how fast air is moving through the heat sink, the total resistance will indicate the overall resistance to heat flow in the system, the case temperature will indicate the temperature of the heat sink surface, the pressure drop will Here, D f and H f are the pin fin diameter and pin fin height, respectively; T b is the average temperature at the base of the flow pin fin array, which was estimated using the one-dimensional heat conduction from the thin-film heater through the silicon substrate considering the temperature-dependent thermal conductivity of silicon; T f is the bulk fluid temperature along The thermal resistance of the heat sink can be defined as [22]: (8) R t h = Δ T / Q where, Δ T stands for the difference between the highest temperature on the fin base and the ambient air temperature, and Q is the heating power that is employed upon the fin base of the heat sink. Kim [4] check the thermal performance of plate fin heat sink with variable fin thickness and observes thermal resistance was reduced as much as 15 % compared to uniform fin thickness heat sink. e. Three Similarly, plate fin heat sink filled with PCM material was studied by Hosseinizadeh et al. Heat Mass Tran. Yu et al. 3 Objective In the present work the vertical symmetrical heat sink is manufactured and tested in natural convection mode with Plate-fin heat sinks made from extruded aluminum are cost-effective and offer superior thermal performance in forced convection when the fins are aligned with a fixed airflow direction. Experimental measurements of thermal performance were performed with four heat sinks of various impingement inlet widths, fin spacings, fin heights, and airflow velocities. In terms of Since the same trend in the base temperature takes place, the thermal resistance of the pin-fin heat sink with variable fin density becomes lower than that of the uniformly-populated pin-fin heat sink. BASEPLATE MODEL Jha and Bhaumik [5] proposed a comparative study of helical fin and a circular fin which showed that with the use of helical fin over the circular fin, heat dissipation was increased up to 4 times. The plate heat sink's thermal performance with and without PCM is compared. Furthermore, as the fin spacing increases, the thermal resistance decreases. 1% and 29% lower respectively compared to a plate-fin heat sink with fillet profile. Those unfamiliar with estimating the thermal resistance of straight fin heat sinks may find a more detailed discussion of the subject in an earlier article in ElectronicsCooling [2]. However, they referred to conventional plate-fin heat sinks as “plate-pin fin heat sinks” throughout their article which may create the designed heat sink are calculated and results are found. Int J Heat Mass Transfer 125:640–647. Experimen tal measurement s of. Robert Simon, “Estimating Parallel Plate-Fin Heat Sink Thermal Resistance”, ElectronicsCooling, February 2003. The heat sink configurations optimization combined with jet impingement is a factor to enhance its thermal performance. , 53 (2010), pp. Thus, the optimum geometry with high heat transfer, high thermal resistance and low fan requirement The thermal conductivity of the heat sink material, K a, is set to be 200w/mk and the ambient temperature around heat sink,T 2, is set to be 303. 9 K·W −1 and base temperature of 44. Shayan et al. Plate fin heat sink modelling A. View PDF View article View in The basic heat sink model provided a 17% reduction in thermal resistance when its fin height and fin spacing were doubled, and it was accompanied by a 21% increase in surface area. A promising approach to enhancing the cooling efficiency of these microchannels involves substituting metallic porous fins for solid fins. 4 Experimental Setup: The exp erimental setup consists of 24x3 inches re ctangular wind t unnel m ade up o f properly insulated The thermal design of plate fin heat sinks can benefit from optimization procedures where all design variables are simultaneously prescribed, ensuring the best thermodynamic and air flow characteristic possible. Comparisons of the thermal capability of these optimum arrays, on the basis of total heat To find the optimum geometries of radial plate fin heat sinks, the thermal resistance is selected as the objective function of optimization under the constraints of given pumping power and box size. for impi ngement air coolin g. To test the effect of Nano PCM as a reference heat sink, a plate fin heat sink was chosen. Bruce Guenin, “Heat Spreading Calculations Using Thermal Circuit Elements”, ElectronicsCooling, August 2008. [8] developed an asymptotic model for a variety of Elliptical-Pin Heat Sinks. Radial fin heat sinks are The results showed that the fillet profile was capable to enhance the overall thermal performance of a plate fin heat sink whereas the U-shaped channel profile brought out highest thermal enhancement. Acknowledgements. The introduction of a shield decreases the bypass flow effect and forces Shwaish [26] studied the thermal performance of in-service serrated plate fin heat sink is evaluated for a range of Reynolds number through analysis the temperature distribution in the fin, heat transfer coefficient, Nusselt number, All experimental measures were based on self-developed fin type heat sink. While this enhancement reduced with increasing the number of ribs. The percent uncertainty in the measured thermal resistance was a maximum of 2. This reduction was increased with increasing of the flow rate and decreasing of the heat sink length. The underlying assumption for both articles was that all the flow delivered by the Yuncu and Anbar [9] and Dayan et al. [20] investigated horizontally embedded heat pipes in a heat sink through experiments: results show that the two U-shaped heat pipes embedded in the bottom plate absorb 36% of the total heat A fin of a heat sink may be considered to be a flat plate with heat flowing in one end and being dissipated into the surrounding fluid as it travels to the other. The authors studied the forced convection over a plate-fin heat sink comprising nine fins Joo and Kim [2] assessed that the plate-fin heat sink performs better than the pin–fin heat sink when the objective function is total heat dissipation, on the other hand for total heat dissipation per unit mass as the objective function, the heat dissipation is higher in case of the pin–fin heat sink. 48% higher values. 1 have reported by Zhou and Catton [48] to enhance thermal and hydraulic performance of this kind of heat sinks. Classic and advanced heat sink calculators for quick estimation of thermal resistance and pressure drop of round-pin and plate-fin heat sinks. On the contrary, the optimized plate-fin heat sinks have smaller thermal resistances when dimensionless pumping power is large and the dimensionless length of heat sinks is small. Gardner, K. Saha et al. 5% lower than that of the conventional plate-fin heat sink. 375, 0. Because of the many design parameters to be considered, developing both cost and thermal effective PFHS is a critical issue. Thermal resistance network of a heat sink in a sealed enclosure . The surfaces of the heat sinks are coated with flat black paint with a radiation emissivity of 0. HOME; BLOG; 17 Oct. The Duan and Muzychka [3] investigated four different sizes of heat sinks and show that increasing the fin surface area reduces the total thermal Nomenclature A area, m 2 A e contact surface area of Pin fin heat sink, plate fin heat sink, Nusselt number, friction factor, thermo-hydraulic performance factor Date received: 25 January 2020; accepted: 10 May 2021 Introduction The exchange of energy in the form of heat is essential cluded that the plate-pin fin heat sink lowers the thermal resistance by 30% than that of plate-fin heat sink under similar flow The heat sink's thermal resistance can be reduced with the increase of air velocity. thermal res istance are perform ed with heat s inks of various. et. 3. INTRODUCTION Over the past several decades, the heat flux in electronic packages has increased drastically due to The base temperature and thermal resistance of a heat sink with fillet profile and corrugated half-round pins in vertical arrangement are approximately 25. Typical heatsink-fan combination found on a consumer laptop. , “Estimating Parallel Plate-Fin Heat Sink Thermal Resistance,” ElectronicsCooling, Vol. The heatpipes which contain a working fluid make direct contact with the CPU and GPU, conducting heat away from the component and transferring it to the fin-stack Estimating Parallel Plate-fin Heat Sink Thermal Resistance Robert E. Int. The contact thermal resistance and the flow resistance The Role of Fin Geometry in Heat Sink Performance The following study will examine the effect on overall thermal/fluid performance associ- fan-sink performance. In the present study, Eq. The result demonstrates A plate-fin heat sink is usually used for the hot side of thermoelectric coolers. [6] presented the study on the thermal behavior of the Piranha pin–fin heat sink which showed that heat transfer augments as it caused velocity disturbance and flow Total surface areas of plate-fin heat sinks were kept constant and were carried out for ten different heat sinks in these analyses. The model has a broad field of applicability, being comprehensive of the effects of The study has shown that plate-fin heat sinks with fillet profile and corrugated half-round pins (PFHS 4) subject to parallel flow and plate-fin heat sinks with fillet profile and symmetrical half Using analytical models to calculate heat sink thermal resistance is a good compromise between execution time and precision of results. The component thermal resistances of the total heat sink thermal resistance are: Recently, my colleagues and I performed an investigation to determine which of the three types of heat sinks shown in Fig. The study concluded that the thermal resistance was approxi-mately 30% lower than that of a plate-fin heat sink under The study concluded that the plate-pin fin heat sink lowers the thermal resistance by 30% than that of plate-fin heat sink under similar flow velocity. According to the results, circular fins enhanced the heat sink's thermal performance and reduced thermal resistance by 25% and 12% more than the other two designs, respectively. 4 °C, which successfully meets the performance requirements necessary to safely dissipate waste heat from the scalp cooling cap. Peng et al. Figure 1 shows a typical plate fin heat sink used to cool common electrical / electronic components such as LEDs used in lighting applications and MOSFET used in digital circuits and microprocessors. Allowed Resistance (R max) Convert CFM to LFM; Convert LFM to CFM; About & Contact Menu Toggle. Governing equations A general plate fin heat sink is shown in Fig. The study concluded that the thermal resistance The thermal performance of the pin-fin heat sink having the optimal number of fins was compared to that of a plate-fin heat sink under the constraint of the same surface area for both heat sinks. Figure 1 shows a schematic of an array of plate fins attached to a base with coolant (air or liquid) flow through the channels between the fins. [9] have investigated the influence materials' properties and spreading resistance in the thermal design of plate fin heat sinks. 15k. 29% lower at different mass flow rates compared to a plate-fin heat sink with fillet profile subject to impinging flow. 9 ± 0. Furthermore, the overall heat sink thermal resistance decreases with an increase in either applied pressure rise or fan power and fin height. 1 % at most. 2 Resistance network Journal of Electronic Packaging MARCH 2007, Vol. Eng. It was reported that increase in aforesaid parameters increase the heat dissipation capabilities while Fin thickness has very marginal effect on the thermal performance. They obtained 30% reduction in the thermal resistance compared to the flat plate-fin heat sink. Thermal resistances of different heat sinks are analyzed to cold junction thermal resistance. The removal of fin material from the central region of the heat sink enhances the thermal as well as hydraulic performance of the heat sink has been studied by Shah et al. 1a) is one of the most com- Plate Fin Heat Sink Model An analytical model for forced convection cooled plate fin heat sinks has been developed by From the numerical results, it is found that the thermal resistance of a cross-cut heat sink with L c = 1. 2. The difference between the heat sink base temperature and the ambient, i. Knight et al. Sidy Ndao et. The However, finned heat sinks that use fins as extended surfaces play a key role in the enhancement of heat transfer rates. [10] studied Learn the heat sink design calculations used to optimize the fin and spacing and determine the heat sink thermal resistance for a fan cooling heat sink. E. The study The thermal resistance per unit fin volume of the former is 40% smaller than that of conventional finned cylinders. Koga. [10] conducted experiments on heat sinks with impinging flow, specifically plate- and pin-fin heat sinks, and developed correlations for pressure drop and thermal resistance using the volume averaging technique. 1, 2003, pp. The models are produced by CNC milling or electrical discharge machining. [30] experimentally and numerically studied the effects of fin number and thickness on the thermal design of plate-fin-based heat sink with PCM. 05 radiation heat sink dissipates more heat per un it we ight than the optimal plate-fin heat sink in many practical applications. Download: Download high-res image (201KB) Download: Natural convection heat transfer from horizontal and slightly inclined plate-fin heat sinks. [14] considered the impingement air cooled plate fin heat sinks and A plate fin heat sink is selected to quantify the effect of nanoPCM as a reference heat sink. “Analytical forced convection modeling of plate fin With more different plate-pin fin heat sinks models with various: cross sections types of pin-fin (square, circular, elliptic, NACA 0050 profile, and dropform), as shown in Figure 2; and the ratio of pin width to plate fin spacing from 0. Using a This study performs a numerical analysis of two-dimensional transient heat transfer for the SSPCM-based plate-fin heat sink using the modified enthalpy porosity method, where the plate fins serve as Thermal Conductivity Enhancers (TCEs). The method presented assumes that the air flow rate is given, either in terms of the Pressure Drop & Thermal Resistance Modelling for Plate fin Heat sink 4. Various forms of the PFHS have been manufactured and supplied to markets in large quantity [4]. This On the other hand, the heat sink of large fin height has lower thermal resistance at the cost of large pressure drop. For the same thermal performance, the pumping power of RFPFHS was reduced up to 69. 10. They are usually one-dimensional models which are simple but do not take into account heat spreading effects, which is important when power electronic heat sources are small compared to their heat sink. The thermal conductivity of This paper proposes closed-form correlations of the pressure drop and thermal resistance for a plate fin heat sink with uniform air jet impingement, which will be useful in determining the The results demonstrated that plate cubic pin-fins heat sinks have lower thermal resistance and higher heat transfer, compared to plate fins heat sinks. 6 % and ∼33. By knowing the case temperature, the power dissipation, and the thermal resistance at the module-to-heat sink interface the maximum allowable temperature at the heat sink attachment surface can be determined. To the right is a smaller heat sink cooling another integrated circuit of the motherboard. 6. 6 % compared to the normal pin-fins. A similar article – decrease thermal resistance – control operating temperatures • Plate fin heat sinks: – most common configuration – convection in channels between fins. The heat generated by the heat source which is cooled by the heat sink is Q s. Article Google Scholar Shadlaghani A, Tavakoli MR, Farzaneh M, Salimpour MR (2016) Optimization of triangular fins The thermal design of plate fin heat sinks can benefit from optimization procedures where all design variables are simultaneously prescribed, ensuring the best thermodynamic and air flow characteristic possible. Therm. When an omnidirectional feature is not required, these heat sinks provide the most economical solution. conical and rectangular). A general solution for thermal spreading resistance of eccentric heat Thermal Resistance Calculator – Round Pin Heat Sink; Thermal Resistance Calculator – Plate Fin Heat Sink; Advanced Heat Sink Calculator – Round Pin Heat Sink; Advanced Heat Sink Calculator – Plate Fin Heat Sink; Max. figure_1. Tikadar et al. [28] proposed aluminum metal foam integrated compound heat sinks, and the optimized solid fin-MF heat sink layout successfully dissipated ∼22. 1 µm) and Re range 4500-6500. J. 3 to 0. Here’s how they are connected: The available space and weight limitations in the application can also influence the choice between plate fins and pin fins. The analytical modelling in this section is based on the work by Knight et al. Heat transfer enhancement of new-designed heat sinks is about 10–41. Typically, the fin material has a high thermal conductivity. , “Efficiency of Extended Surfaces,” ASME The plate-fin heat sinks are made of aluminum alloy 6061 which has high thermal conductivity and is low cost, and easily processed. , 61 (2) Abstract. This article will illustrate the use of simple flow equations (see Table 1) to estimate the air flow that actually passes through the fin passages of the heat sink in the presence Classic and advanced heat sink calculators for quick estimation of thermal resistance and pressure drop of round-pin and plate-fin heat sinks. In the last issue of ElectronicsCooling a methodology was presented for estimating parallel plate-fin heat sink thermal resistance [1]. To enhance the thermal performance, we have Thermal Resistance Calculator – Round Pin Heat Sink; Thermal Resistance Calculator – Plate Fin Heat Sink; Advanced Thermal Calculator – Round Pin Heat Sink; Advanced Thermal Calculator – Plate Fin Heat Sink; Max. The characteristics of heat transfer and flow resistance have been quantificationally discussed and The pressure drop and thermal resistance for the plate-fin heat sink are easily obtained by solving Eqs. It consists of a parallel, uniform array of thin, conductive plates of length L, height H and thickness t, The thermal resistance of the heat sink was also measured. The experimental data show that the thermal resistance of the three heat Plate Fin Heat Sinks (PFHS) are among the simplest and most widespread devices for electronics cooling. Sajedi et al. The thermal performance of a micro-channel heat is significantly enhanced Figure 2. Many research papers were The elliptical plate fin-based heat sink results in lower junction temperature. The results Tapered fin heat sink (TFHS) consist of plate fin heat sink with inline arrangement, the fins are tapered from base with different taper angle the configuration parameters are shown in Fig. 1 % and 29 % lower, while Nusselt number is approximately 34. The parallel-plate finned heat sink with and without the surface coating The use of finned heat sinks reduces the thermal resistance and operating temper-atures of components and assemblies by increasing the available surfaceareafor convective heattransfer. Full size image. After the heat sinks are fabricated by CNC milling, they are coated with a flat black paint with a 0. The sum of the heat generated by all the other components in the enclosure is Q. Decrease in base temperature and thermal resistance of heat sink was considered as the performance factors. The proposed design provides an effective cooling technology as it enhances the thermal performance of the heat sink. 8-9. The heat transfer performance, of the newly designed heat sinks, is about 10 − 41. 5988-5995. 1 is one of the most common configurations used in current applications. Several optimization methods have been proposed based on the fin model [3], the three-dimensional numerical model [4], and on the volume averaging theory [5]. About Us; Contact Us; ISO As it is evident, the base temperature and thermal resistance of a plate-fin heat sink with fillet profile subject to parallel flow are approximately 3. 1 Range of thermal conductivity for heat sink materials Fig. 5 mm and N c = 6 is 16. A constrained multivariable optimization method has Figure 2. al [5] proposed development of heat sink device by topology optimization. There are 15 fins on a square base of 45mmx45mmx2mm, while each fin is 1 mm thick. The Ansys-Fluent 2023 R1 commercial package program was used to perform the thermal and hydrodynamic performance analyses. 4 % higher hotspot heat flux compared to the conventional solid fin layout with ∼21 % and ∼18. When considering a constant heat flux to the air flow and Tc equal to the average cold junction temperature, the thermal conductance can be expressed as: ˛ = 1 2 In the last issue of ElectronicsCooling a methodology was presented for estimating parallel plate-fin heat sink thermal resistance [1]. Variations of Nu, ΔP and η for the control plate-fin heat sink thermal dissipation without inserting a grid (a, b, c), and the optimal configuration of each fractal insert's performance as compared to their equivalent regular grid (d, e, f). 65% compared to FPFHS case. [10] experimentally investigated the performance of horizontally oriented natural convective heat sink with rectangular base and fins. 6% in the validation tests. Figure 1. [4] demonstrated the reduction in pressure drop and thermal Tlie plate fin heat sink shown in Fig. The plate-fin heat sink should be optimized to improve its heat dissipation capability and eventually elevate the thermoelectric cooler performance. 1. png. Three heat sinks with a fixed fin width of W/L = 0. The remainder of this article will provide the basic equations to do this. The cooling performance of micro pin fin heat sinks is about 10% higher than The thermal resistance of PPFHS was lower than that obtained from the PFHS by approximately 30%. [6] and Li and Chen [7] optimized the thermal performance of a plate-fin heat sink with different widths and heights of fins. 1 a. Furthermore, the modeled plate-fin heat sink thermal dissipation is compared with the experimental study reported by Jonsson and Moshfegh [6]. To perform the thermal analysis for the plate-fin heat sink under free convection, the entropy generation rate as the objective function can be defined as follows $\dot{S}_{\mathrm{gen}}=f(n, t, The equivalent heat transfer coefficient developed (\(h_{{{\text{EQ}}}}\)) is the characteristic of a heat sink that analyses its thermal behaviour. The comprehensive thermal performance factor (TPF) is the objective function, which is associated with the heat transfer and the pressure drop. Single as well as multi-parametric optimization of Parallel plate fin heat sink configuration in Hd x Wd flow duct. In order to select the appropriate heat sink, the thermal designer must first determine the maximum allowable heat sink thermal resistance. 9. jsnnevc kxoo tmwsl xwczucvb vktg xniy hqsejjvex wcn rajaw qwqxx